About ICEP 2020
ICEP 2020 will be held from April 22 to 25, 2020 in Tokyo, Japan.
ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, thermal management.
Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.
Organization
General ChairEiji Higurashi, National Institute of Advanced Industrial Science and Technology
General Vice Chair
Shigenori Aoki, LINTEC
Katsumi Miyama, Hokkaido University of Science
Akitsu Shigetou, National Institute for Materials Science
Operation Committee Chair
Katsumi Miyama, Hokkaido University of Science
Operation Committee Vice Chairs
Hajime Hirata, Toray Engineering
Koichi Hirata, Namics
Mitsuyo Miyauchi, ALPHA-DESIGN
Miki Mori, the University of Tokyo
Yoshio Nogami, Toray Engineering
Akira Yamauchi, National Institute of Technology, Gunma College
Operation Committee Members
Hidenobu Deguchi, Sekisui Chemical
Ryo Endoh, Toray Research Center
Jin Fujimura, ePRONICS
Maki Ito, Hitachi
Minami Kaneko, Nihon University
Hidetoshi Kitaura, Panasonic
Yoshiteru Kono, OMRON
Makiko Nagao, Nagase
Keishi Okamoto, Huawei Technologies Japan
Kazuo Shimokawa, Toshiba
Jun Shirakami, DIC
Takahito Watanabe, IBM Japan
Noriyasu "Notch" YAMANE, Mitsubishi Chemical
Akira Yamauchi, Bondtech
Akihiro Yanami, DAISHO DENSHI
Technical Program Committee Chair
Akitsu Shigetou, National Institute for Materials Science
Technical Program Committee Vice Chair
Shinya Takyu, LINTEC
Naotaka Tanaka, Hitachi Chemical
Yoshihiro Tomita, Intel
Technical Program Committee Members
Tomoyuki Abe, FUJITSU
Toyohiro Aoki, IBM Japan
Masahiro Aoyagi, National Institute of Advanced Industrial Science and Technology
Takahiro Arakawa, Tokyo Medical and Dental University
Noriyuki Fujimori, OLYMPUS
Masahisa Fujino, National Institute of Advanced Industrial Science and Technology
Koichi Hasegawa, JSR
Nobuaki Hashimoto, Suwa University of Science
Tomoyuki Hatakeyama, Toyama Prefectural University
Sumito Hayashida, ASE Group
Koichi Hirano, Panasonic
Hiroshi Hozoji, National Institute of Advanced Industrial Science and Technology
Yuki Inaba, DENSO
Masahiro Inoue, Gunma University
Takashi Kasahara, Hosei University
Yu Kondou, OLYMPUS
Tadao Matsunaga, Tottori University
Jun Mizuno, Waseda University
Yasuhiro Morikawa, ULVAC
Shinichi Nishi, National Institute of Advanced Industrial Science and Technology
Toshio Nonaka, Hitachi Chemical
Masaaki Oda, Printed Electronics Network
Takayuki Ohba, Tokyo Institute of Technology
Hideo Ohkuma, HTO
Kazuya Okamoto, Yamaguchi University
Tetsuya Onishi, Grand Joint Technology
Shuji Sagara, Dai-Nippon Printing
Yoichiro Sato, AGC
Koichi Shibayama, Sekisui Chemical
Osamu Suzuki, NAMICS
Fumio Uchikoba, Nihon University
Masahide Ueda, Tokuyama
Shoji Uegaki, E-ThermoGentek
Hiroshi Yamada, Toshiba
Keiju Yamada, Toshiba
Kiyokazu Yasuda, Osaka University
International Technical Committee Members
Charles E. Bauer, TechLead
C. Robert Kao, National Taiwan University
Taek-Soo Kim, Korea Advanced Institute of Science and Technology
Shi-Wei Ricky Lee, Hong Kong University of Science & Technology
Shih-kang Lin, National Cheng Kung University
Guo-Quan Lu, Virginia Tech
Jenn-Ming Song, National Chung Hsing University
Tianchun Ye, Institute of Microelectronics of Chinese Academy of Sciences
Publication Chair
Tomoyuki Hatakeyama, Toyama Prefectural University
Publication Member
Hitoshi Sakamoto, Huawei Technologies Japan
Finance Chair
Taiji Sakai, Fujitsu Interconnect Technologies
Finance Vice Chair
Shoichi Ishikawa
Advisory
Yasuhiro Ando, ABI Giken
Yoshitaka Fukuoka, Worldwide Electronic Integrated Substrate Technology
Masaru Ishizuka, Toyama Prefectural University
Kaoru Hashimoto, Meisei University
Kenzo Hatada, Atomnics Laboratory
Hideyuki Nishida, NEP Tech. S & S
Takashi Nukii, Kyoko University
Atsushi Okuno, Green Planets
Kanji Otsuka, Meisei University
Osamu Shimada, Dai Nippon Printings
Yuzo Shimada, NAMICS
Tadatomo Suga, Meisei University
Katsuaki Suganuma, Osaka University
Haruo Tabata, C-net
Shinichi Wakabayashi, Nagano Techno Foundation
Kishio Yokouchi, Japan Jisso-Interconnect Solutions Laboratory