General Information

[Announcement of ICEP 2019 Award Winners]
Outstanding Technical Paper Award
High-Speed High-Density Cost-Effective Cu-Filled Through-Glass-Via Channel for Heterogeneous Chip Integration
Hiroshi Kudo, Miyuki Akazawa, Shouhei Yamada, Masaya Tanaka, Haruo Iida, Jyunya Suzuki, Takamasa Takano, Satoru Kuramochi, DNP Co., Ltd. / Japan

Processing and Characterization of Die-Attach on Uncoated Copper by Pressure-Less Silver Sintering and Low-Pressure-Assisted Copper Sintering
Meiyu Wang1, Yanliang Shan1 , Yunhui Mei1 , Xin Li1, Guo-Quan Lu1,2, 1Tianjin University / China, 2Virginia Tech / USA

Inhibition of Cracking in Cu6Sn5 intermetallic Compounds at the Interface of Lead-Free Solder Joint by Controlling the Reflow Cooling Conditions
Flora Somidin1,2, Stuart D. McDonald1, Xiaozou Ye1, Dongdong Qu1, Keith Sweatman3, Tetsuya Akaiwa3, Tetsuro Nishimura3, Kazuhiro Nogita1, 1The University of Queensland / Australia, 2Universiti Malaysia Perlis / Malaysia, 3Nihon Superior Co., Ltd. / Japan

High-Toughness (111) Nano-Twinned Copper Lines for Fan-Out Wafer-Level Packaging
Yu-Jin Li1, Wei-Yu Hsu1, Benson Lin2, ChiaCheng Chang2, Chie Chen1, 1National Chiao Tung University, 2MediaTek Inc. / Taiwan

Programming and Evaluation of a Multi-Axis/Multi-Process Manufacturing System for Mechatronic Integrated Devices
M.Ankenbrand, Y.Eiche, J.Franke, Fridrich-Alexander University Erlangen-Nuremberg / Germany

IEEE EPS Japan Chapter Young Award
Correlation between Insertion Loss and Interface Relative Conductivity
Taiga Fukumori, Fujitsu Laboratories Ltd. / Japan

Evaluation and Benchmarking of Cu Pillar Micro-Bumps with Printed Polymer Core
Xing Qiu, Hong Kong University of Science & Technology / Hong Kong

Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition
Hiroyuki Kuwae, Waseda University / Japan

A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere
Runhua Gao, Osaka University / Japan

JIEP Poster Award
Au-Sn Soldering Using a Micro-heater to Restrain Excess Temperature Rise Inside the Package
Hideaki Mizusaki, Toshiro Sato, Makoto Sonehara, Shinshu University / Japan

Wafer-scale Au-Au surface activated Bonding Using Atmospheric-Pressure Plasma
Michitaka Yamamoto1,2, Takashi Matsumae2, Yuichi Kurashima2, Hideki Takagi2, Toshihiro Miyake3, Tadatomo Suga1, Toshihiro Itoh1, and Eiji Higurashi1,2, 1The University of Tokyo, 2National Institute of Advanced Industrial Science and Technology, 3Denso Corporation / Japan

Study of Low-Residual Stress Amorphous Film Deposition Method for LiTaO3 / Quartz or LiNbO3 / Quartz Bonding toward 5G Surface Acoustic Wave Devices
Ami Tezuka1, Hiroyuki Kuwae1, Kosuke Yamada1, Shuichi Shoji1, Shoji Kakio2, Jun Mizuno1,3
1Waseda University, 2Yamanashi University / Japan, 3Soochow University / China

[Important Notice] Cancellation of ICEP 2020

It is with deep regret that we are informing you of the cancellation of the ICEP 2020 due to the ongoing situations of the new coronavirus (COVID-19) epidemics in Japan. The health and safety of all the participants is our top priority. Please accept our deepest apologies for any inconvenience this may have caused. We sincerely appreciate your cooperation and understanding.

Our cancellation policy of the ICEP 2020 is as follows.
  • All presentation sessions are cancelled.
  • All submitted papers will not be published in the Proceedings.�@Accordingly, the full copyright will revert to the author as original copyright holder.
  • We will refund the full registration fee that you have already paid to us.
  • We will refund the full sponsor fee that you have already paid to us.
Regarding the refund method, we will inform the details later by e-mail.

We look forward to seeing you at next ICEP 2021 in the future.

2020 International Conference on Electronics Packaging
(ICEP 2020)

Date: April 22-25, 2020
Venue: The National Museum of Emerging Science and Innovation, Tokyo



Call for Papers
We are waiting for your abstract submission.
Information of call for papers: English ver.  

Please prepare an abstract using the attached template to help us better evaluate your submission.
The abstract should contain about 1 page of text and 1 page for supporting figures and tables, with a total length of 2 pages at maximum. Figures and tables to support the point of the paper will receive positive considerations. Your abstract will be used for review purpose only and will not be included in the conference proceeding.

Thank you very much for your contribution!

Important Dates

Abstract submission open: August 1, 2019
Abstract deadline: October 31, 2019November 10, 2019
Notification of acceptance: December 13, 2019
Final manuscript deadline: February 1, 2020