Development of Autonomous Driving Technologies and its future

 Ryota Shirato
 Manager, Mobility Services Laboratory, Nissan Research Center, Nissan Motor Company

The momentum of autonomous vehicle development has been rising globally. Under such circumstance, Nissan exhibited autonomous vehicle technologies in several events, such as "Nissan 360" in California, USA in August 2013, “CEATEC” Combined Exhibition of Advanced Technologies in Makuhari, Japan in October 2013 and so on. Nissan also announced that the company will be ready with multiple, commercially-viable Autonomous Drive vehicles by 2020. The company's engineers have been carrying out intensive research on the technology for years, alongside teams from the world's top universities. In this speech, some of those autonomous technologies will be introduced and the future perspective will be surveyed.

 Hybrid Memory Cube: The New Standard for Memory Performance 

 Scott Graham
 General Manager, Hybrid Memory Cube Technology Micron Technology, Inc.

  The challenge of constrained memory bandwidth, a key problem for applications in both high performance computing and networking, is driving dramatic change throughout the memory landscape. Micron Technology is addressing this challenge with its Hybrid Memory Cube (HMC), which is currently sampling a 2GB device. HMC represents an entirely new category of high performance memory, delivering unprecedented system performance and bandwidth at a fraction of the total cost of ownership of equivalent DRAM solutions. Industry engagement and adoption for HMC has been overwhelmingly positive. Top industry innovators are leading the HMC Consortium which includes over 120 adopters to date. According to research analysts at Yole Développement, TSV-enabled devices such as HMC will account for nearly $40B by 2017 - 10% of the global chip market.
  Mr. Graham's presentation will show how Micron is leading the development of 3D TSV devices through HMC and derivative technologies. Additional information on HMC's functionality, benefits, and future applications as well as tools and ecosystem development will also be covered.

Introducing the latest 3D printing technology and applications

 Nave Rachman
 Pre-Sale & Application Manager, Stratasys Asia Pacific & Japan

  Stratasys Ltd. is the corporate entity formed in 2012 by the merger of 3D printing companies Stratasys Inc. and Objet Ltd., based in Minneapolis, Minn. and Rehovot, Israel. Stratasys manufactures 3D printers and materials for prototyping and production. The company's patented FDM® and PolyJet® processes produce prototypes and manufactured goods directly from 3D CAD files or other 3D content. Systems include affordable desktop 3D printers for idea development, a range of systems for prototyping, and large production systems for direct digital manufacturing. Since June 2012, the company's range of over 130 3D printing materials is the widest in the industry and includes more than 120 proprietary inkjet-based photopolymer materials and 10 proprietary FDM-based thermoplastic materials. Nave will introduce Stratasys leading 3D printing technology, and also key benefits which the technology will bring to the customers through various application case studies.

 Implementation of high-volume genomic analyses by microfluidics/microchip technologies: Towards integrative medical sciences for preventive medicinen

 Osamu Ohara
 Deputy Director, Kazusa DNA Research Institute;
 Group Director, Laboratory for Integrative Genomics, RIKEN Center for Integrative Medical Sciences 

 More than ten years have already passed since the human genome sequence first became publicly available. After taking this monumental step in the history of humankind, DNA sequencing technologies have kept advancing without decreasing its pace; it is now expected to make it possible to analyze the genetic information consisting of 1 terabases (corresponding to 300 x human genome) in a week in the very near future. In this regard, it should be emphasized that such ultra-high throughputs of DNA sequencing technologies could not be realized without integration of microfluidics/microchip technologies. In other words, the high-volume genomic analyses solely depend on massively parallel micro-reactions in an ultra-low volume. As well demonstrated by this fact, the microfluidics/microchip technologies have considerably increased their significance and are currently indispensable in the field of medical sciences as well as general biology. In my personal perspectives, the microfluidics/microchip technologies would be absolutely invaluable to genomic analyses toward preventive medicine based on personal genomic information. However, because there still remain many missing tools toward this end, closer and tighter collaboration among multidisciplinary researchers are strongly required to address the remaining problems. In particular, I would put special emphasis on single-cell analysis because it is one of the hottest technology fields in medical sciences. In this lecture, I would like to offer some future perspectives toward preventive medicine on the basis of my 20-year experiences in genomics, starting from the history of biophysics, molecular biology, and genomics.

 Gen-3 Embedded Cooling: Completing the Inward Migration of Thermal Packaging

 Avram Bar-Cohen
 DARPA-MTO 

  The increased 2D and 3D integration density of electronic components and subsystems has exacerbated the thermal management challenges facing electronic system developers. The sequential conductive and interfacial thermal resistances, associated with the prevailing use of attached microcoolers has resulted in only limited improvements in the overall junction-to-ambient thermal resistance of high-performance electronic systems during the past decade. These limitations of Commercial Off-The-Shelf (COTS) thermal packaging are leading to a growing number of products that fail to realize the inherent capability of their continuously improving materials and architecture and thermal management hardware today accounts for a large fraction of the volume, weight, and cost of electronic systems.
  To overcome these limitations and remove a significant barrier to continued Moore’s Law progression in electronic components and systems, it is essential to implement aggressive thermal management techniques that directly cool the heat generation sites in the chip, substrate, and/or package. The development and implementation of such “Gen-3” embedded thermal management technology, combining intrachip microfluidics with high conductivity thermal interconnects, promises to enable compact microsystems with unprecedented performance. This Keynote lecture will address the motivation, opportunities, current state-of-the-art, and research challenges associated with this embedded cooling thermal management paradigm.