Call For Papers


Abstract Deadline and Paper Submission:


A 300-word abstract to be submitted to the web site by October 31, 2013.
Abstract submission web site will open on September, 2013
It is recommended to attach one piece of figure, picture or table.
Notification of acceptance on December, 2013.
Final manuscript to be submitted by the end of February, 2014.


Sessions and Keywords:
1. Advanced Packaging
Wafer Level Packaging, System Integration, PoP, MCM, System on Package, Novel Assembly Technologies 
2. Substrate and Interposers 
Laminates, Interposers, Fine Pitch, Build-up Substrates, Flexible Printed Circuits, Embedded, Conductive Paste, Thin Core, Coreless, Low CTE
3. Interconnection
Bump Formation, Chip-Package Interaction, Low k, Leadframe, Test of First- and Second- Level Interconnections, Interconnections for 3D Integration, Interconnections in Substrates, PCBs and Systems
4. 3DIC Packaging
TSV, Via Formation and Filling, 2.5D, Wafer Thining, Silicon Stacking, Chip on Chip, Chip on Wafer, Wafer on Wafer, Wide Bus, Wireless Interconnection, Temporary Bonding/De-Bonding
5. Design, Modeling, and Reliability
Signal and Power Integrity, High Speed Board Design, Mechanical Design and Reliability, Failure Analysis, Fracture and Warpage in Packages, Testing, Evaluation, TCAD, 3DIC Design
6. Thermal Management
Advanced Cooling Modules, Heat Pipes, Heat Sinks, Fans and Blowers, Thermal Interface Materials, Thermal Measurements, Micro and Nano Scale Heat Transfer, Thermal Issues in Devices
7. Materials and Process
Novel Materials and Processing, Dielectrics, Emerging Materials and Processes for 3D, Thin Films, Underfills, Assembly Challenges and Solutions, Wefer Thinning, Plating, Equipment, Encapsulation
8. Printed Electronics
Inkjet, Screen Printing, Conductive Wiring, Insulation, Printed Organic TFTs, Device Applications
9. N-MEMS
NEMS-MEMS/Sensor Devices, MOEMS, Assembly and Packaging, Nano Technology, Nano Imprint Lithography, Organic Semiconductors, Wireless Sensor Networks
10. Optoelectronics
Active Optical Cable, Photonic Devices, Optical Fibers, Waveguides, Optical Interconnects, Transceivers, Connectors, LD/PD, LED, OE/EO, TOSA/ROSA, WDM, Optical Wiring Boards
11. Self-Organization/Self-Assembly
Biomimetic, Nature-Guided, Bottom-up Manufacturing, Smart Materials and Devices, Spontaneous Ordering/Patterning/Structuring, Self-Bonding/Debonding, Repairable, Self-Healing, Novel Micro/Nano Processing
12. Medical Devices
Invasive, Low Invasive, Non Invasive, In Vitro, BAN, Cure, Treatment, Diagnosis, Screening, POC, Healthcare
13. Power Devices
Power Electronics, Power Devices, Automotive Electronics, ECUs, Sensors, Lead Free Solder, Wire Harness, Energy Harvesting
14. RF
RFID, High Frequency Devices, Packaging, Filters, EMI, EMC, Antennas, Wireless Power Transmission 
15. Others
Market Trends, Environmentally Conscious Products and Processes, Cost Analyses

 



 

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