AWARD

ICEP2013 OUTSTANDING TECHNICAL PAPER AWARDS

“Transient Heat Transfer of The　Microprocessor System
Investigation regarding Natural　Convection with Slate Style Chassis”

K. Nishi¹, T. Hatakeyama², M. Ishizuka²
¹AMD Japan, ²Toyama Prefectural University

“Cooling Strategy and Structure of 3D Integrated Image Sensor for Auto-mobile Application”

F. Yamada¹, K. Matsumoto¹, T. Hatakeyama², M. Ishizuka²,
K. Otsuka³, K. Kondo⁴, H. Kobayashi¹, K. Sueoka¹, A. Horibe¹,
S. Kohara¹, H. Mori¹, Y. Orii¹
¹Association of Super-Advanced Electronics Technologies, ²Toyama Prefectural University,³Meisei University, ⁴Denso

“Room-Temperature Direct Bonding of GaAs and SiC Wafers for Improved Heat Dissipation in High-Power Semiconductor Lasers”

Eiji Higurashi, Kaori Nakasuji, Tadatomo Suga
The University of Tokyo

“Via Formation Process to Form the Smooth Copper Wiring Using　Adhesion Layer”

S. Sasaki, M. Tani
Fujitsu Laboratories

“Multiscale Modeling of Anisotropic Creep Response of Heterogeneous Single Crystal SnAgCu Solder”

S. Mukherjee, A. Dasgupta
University of Meryland

ICEP2013 IEEE CPMT JAPAN CHAPTER YOUNG AWARDS

“Advanced Through-Silicon Via Inspection for 3D Integration”

Takashi Tsuto
Nikon

“VUV/O3 Treatment for Reduction of Au-Au Bonding Temperature”

Akiko Okada
Waseda University

“Development and Study of Electrical Property on Phantom for Human Body Communication Considering Tissue Structure of
Human Arm”

D. Muramatsu
The University of Tokyo

“A 36 W Wireless Power Transfer System with an 82% Efficiency for LED Lighting Applications”

W. Chen
Industrial Technology Research Institute

ICEP 2013 JIEP POSTER AWARD

“A Proposal of New Electrode Structure for Intra-Body　
Communication”

Takaaki Fujisawa¹, Fukuro Koshiji^1,2, Kohji Koshiji²
¹Kokushikan University, ²Tokyo University of Science

AWARD

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copyright (c) ICEP 2014 All right reserved.

“Transient Heat Transfer of The　Microprocessor System Investigation regarding Natural　Convection with Slate Style Chassis” K. Nishi¹, T. Hatakeyama², M. Ishizuka² ¹AMD Japan, ²Toyama Prefectural University
“Cooling Strategy and Structure of 3D Integrated Image Sensor for Auto-mobile Application” F. Yamada¹, K. Matsumoto¹, T. Hatakeyama², M. Ishizuka², K. Otsuka³, K. Kondo⁴, H. Kobayashi¹, K. Sueoka¹, A. Horibe¹, S. Kohara¹, H. Mori¹, Y. Orii¹ ¹Association of Super-Advanced Electronics Technologies, ²Toyama Prefectural University,³Meisei University, ⁴Denso
“Room-Temperature Direct Bonding of GaAs and SiC Wafers for Improved Heat Dissipation in High-Power Semiconductor Lasers” Eiji Higurashi, Kaori Nakasuji, Tadatomo Suga The University of Tokyo
“Via Formation Process to Form the Smooth Copper Wiring Using　Adhesion Layer” S. Sasaki, M. Tani Fujitsu Laboratories
“Multiscale Modeling of Anisotropic Creep Response of Heterogeneous Single Crystal SnAgCu Solder” S. Mukherjee, A. Dasgupta University of Meryland

“Advanced Through-Silicon Via Inspection for 3D Integration” Takashi Tsuto Nikon
“VUV/O3 Treatment for Reduction of Au-Au Bonding Temperature” Akiko Okada Waseda University
“Development and Study of Electrical Property on Phantom for Human Body Communication Considering Tissue Structure of Human Arm” D. Muramatsu The University of Tokyo
“A 36 W Wireless Power Transfer System with an 82% Efficiency for LED Lighting Applications” W. Chen Industrial Technology Research Institute