ADVANCE PROGRAM

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April 23

Room A (Main Hall)

Room B (201)

Room C (202)

Room D (203)

Room E (204)
13:00
13:25

Opening Ceremony
13:25

14:25

Keynote (Main Hall)

Development of Autonomous Driving Technologies and its future
Ryota Shirato, Nissan Motor Company
14:25
14:35

Break
14:35

15:35

Keynote (Main Hall)

Hybrid Memory Cube: The New Standard for Memory Performance
Scott Graham, Micron Technology, Inc.
15:35

16:35

Keynote (Main Hall)

Introducing the latest 3D printing technology and applications
Nave Rachman, Stratasys Asia Pacific & Japan
16:35
16:45

Break
16:45









































18:00
 WA1: Automotive

WA1-1
Direct Impingement Cooling of LED by Piezo Fan 
Randeep Singh, Ahmad Jalilvand, Kazuhiko Goto, Koichi Mashiko, Yuji Saito, Masataka Mochizuki, Fujikura / Japan

WA1-2 <Session Invited>
A Novel Direct Water and Double-Sided Cooled Power Module for HEV/EV Inverter
Takeshi Tokuyama1, Kinya Nakatsu1, Atsuo Nishihara1, Koji Sasaki1, Ryuichi Saito2, 1Hitachi, 2Hitachi Automotive Systems / Japan

Cancelled
Molding Technology for Highly Integrated Transmission Control Unit
Tetsuto Yamagishi, Takumi Nomura, Kengo Oka, Kazuya Hirasawa, DENSO / Japan

WA1-3
Lead-free Solders for Solar and Electric Vehicles - reflections on the bridgestone world wolar challenge 2013 in “Arrow1”
Kazuhiro Nogita1,2, James Kennedy1,3, John Amsler1, Matthew Greaves1, Cameron Tuesley1, Takatoshi Nishimura4, 1TeamArrow Solar Car Team, 2The University of Queensland, 3Tritium Pty / Australia, 4Nihon Superior / Japan
 WB1: Materials and Processes-1

WB1-1
Effect of Surface Damage on Strength of Silicon Wafer for Solar Cells
Daisuke Echizenya1,2, Katsuhiko Sasaki2, 1Mitsubishi Electric, 2Hokkaido University / Japan

WB1-2 <Session Invited>
Eco-Fabrication of Nano-metal Related Materials by Ultrasound Solid-liquid Reaction
Yamato Hayashi, Tohoku University / Japan

Cancelled
Application of Pin-on-Elastic-
Foundation Test to Evaluating Silicon Die Strength during Pick
and-Place Process
Ming-Yi Tsai1, P.S. Huang1, Jackson Chen2, 1Chang Gung University, 2ASE Group / Taiwan

WB1-3
High Productivity Sputtering System for Seed Layer of Printed Circuit Board
 Tetsushi Fujinaga, ULVAC / Japan
 WC1: Advanced Packaging-1

WC1-1
Newly Developed Ultra Thin Fan- Out Wafer Level Package for PoP Usage
Haruo Shimamoto2, Kyoko Soga1, Katsuya Takemura1, Hideyoshi Yanagisawa1, Satoshi Asai1, Kazunori Kondo1, Michihiro Sugo1, Hideto Kato1, Yoshio Matsuda2, 1Shin-Etsu Chemical, 2Wave Technology / Japan

WC1-2
Wafer Level Package by using Post Dicing Process
Noriyuki Fujimori, Takatoshi Igarashi, Takahiro Shimohata, Takuro Suyama, Kazuhiro Yoshida, Yusuke Nakagawa, Tsutomu Nakamura, Olympus / Japan

WC1-3
Process Integration for Backside Illuminated Image Sensor Stacked with Analog-to-Digital Conversion Chip
H.H. Chang, C.H. Chien, Y.C. Lee, S.M. Lee, J.C. Wang, Y.W. Huang, C.J. Zhan, Z.C. Hsiao, P.J. Tzeng, C.H. Lee, T.S. Chen, C.T. Ko, W.C. Lo, M.J. Kao, ITRI / Taiwan

WD1: Substrates and Interposers

WD1-1
Ultrathin 4-layer Flexible Printed Circuits (FPC) Fabricated by Molecular Bonding Technology
Fong-Ru Lin1, Daigo Suzuki1, Akihiko Happoya1, Manabu Miyawaki2, Kouichi Kamiyama2, Syuukichi Takii2, Takahiro Kudo3, Kunio Mori3, 1Toshiba，2Meiko Electronics, 3Sulfur Chemical Institute / Japan

WD1-2
Advanced Vertical Interconnect Technology with High Density Interconnect and Conductive Paste
Tsuyoshi Tsunoda1, Ryouhei Kasai1, Shozo Yuki1, Naoki Ota1, Keisuke Sawada1, Yuichi Yamamoto1, Yoshitaka Fukuoka2, Shuji Sagara1, 1Dai Nippon Printing, 2Weisti / Japan

WD1-3
Electrical Assessment of Chip to Chip Connection for Ultra High Density Organic Interposer
Keishi Okamoto, Hiroyuki Mori, Yasumitsu Orii, IBM Research -Tokyo / Japan

WE1: Thermal Management-1

WE1-1
The Effect of Thermal Conductivity of Board to Laser Condition in Laser Soldering -The Case of Paste Solder-
Dai Imai, Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru IshizukaToyama Prefectual University / Japan

WE1-2
Basic Study on Flow and Heat Transfer Performance of Pulsating Air Flow for Application to Electronics Cooling
Mutsuki Kichima, Takashi Fukue, Koichi Hirose, Iwate University / Japan

WE1-3
Evaluation of Cooling Performance of a Piezoelectric Micro Blower in Narrow Flow Passage
Takashi Fukue1, Yoshiki Matsuura1, Koichi Hirose1, Hirotoshi Terao2, 1Iwate University, 2ALPS Electronic / Japan

Welcome Reception



April 24

Room A (Main Hall)

Room B (201)

Room C (202)

Room D (203)

Room E (204)
 9:00









































10:40
 TA1: 3DIC Packaging-1

TA1-1
A New Temporary Bonding Technology with Spin-on Glass and Hydrogenated Amorphous Si for 3D LSIs
Hideto Hashiguchi, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi, Tohoku University / Japan

TA1-2
Effects of Ar Plasma and Ar Fast Atom Bombardment (FAB) Treatments on Cu/Polymer Hybrid Surface for Wafer Bonding
Ran He, Tadatomo Suga, The University of Tokyo / Japan

TA1-3
Process Integration of 3D Stacking for Backside Illuminated Image Sensor>
Zhi-Cheng Hsiao, Cheng-Ta Ko, Hsiang-Hung Chang, Huan-Chun Fu, Chao-Kai Hsu, Shu-Man Li, Wen-Li Tsai, Wen-Wei Shen, Jen-Chun Wang, Yu-Min Lin, Wei-Chun Lo, ITRI / Taiwan

TA1-4
Novel 3-Dimensional Package Structure with Micro-Pins and Electronic Components
Nau Negishi, Mikio Nakamura, Takanori Sekido, Tsutomu Nakamura, Yu Kondo, Olympus / Japan
 TB1: Materials and Processes-2

TB1-1
Flip Chip Assembly with Wafer Level NCF
Yuta Kobayashi, Toshihisa Nonaka, Toray Industries / Japan

TB1-2
Novel Low Temperature Curable Photo-Sensitive Insulator
Tomohiko Sakurai, Hikaru Mizuno, Kenji Okamoto, Katsumi Inomata, JSR / Japan

TB1-3
Development of Fine Pitch Negative Tone Resist for Electro- Plating
Hisanori Akimaru, Hidefumi Ishikawa, Hirokazu Sakakibara, Shingo Naruse, Kenji Okamoto, Katsumi Inomata, JSR / Japan

TB1-4 Cancelled
A Novel Study of Mold Compound Effect towards Board-Level Solder Joint Reliability & Process Integration for Power Leadless Package
Hui Teng Wang, Wei Hing Tan, Choke Fei Cheong, INFINEON TECHNOLOGY(M) / Malaysia		 TC1: iNEMI

TC1-1 <Session Invited>
Develop Environmentally Sustainable Electronics
Bill Bader, iNEMI / USA

TC1-2
iNEMI Packaging Technology Roadmap Highlights
Bill Bottoms1, Masahiro Tsuriya2, Chuck Richardson2, 1Third Millennium Test Solutions, 2iNEMI / USA

TC1-3
High-voltage DC–DC Power Module Development
Izuru Narita1, Rick Fishbune1, Randhir Malik1, David Mohr2, Harish Chandra3, Mark Schaffer4, Haley Fu4, 1IBM, 2Hewlett-Packard, 3Cisco Systems, 4iNEMI / USA

TC1-4
Creep Corrosion Test in Flowers of Sulfur Chamber
Haley Fu1, Prabjit Singh2, Jing Zhang2, 1iNEMI, 2IBM / USA		 TD1: Printed Electronics-1

TD1-1 <Session Invited> (50min.)
Imperceptible Organic Electronic Systems for Bio-Medical Applications
Tsuyoshi Sekitani, The University of Tokyo / Japan

TD1-2 <Session Invited>
Automated Manufacturing Line of All-Printed TFT Array Flexible Film
Shinichi Nishi1,2, Toshihide Kamata1,3, 1JAPERA, 2Konica Minolta, 3AIST / Japan

TD1-3 <Session Invited>
Silver nanoInk Sintarable at Low Temperature -Conductive ink for printed electronics-
Toshitsugu Terakawa, Hiroyoshi Koduma, Yuki Iguchi, Kazuki Okamoto, Daicel / Japan
TE1: Power Devices

TE1-1
Thermoelectric Energy Harvesting Characteristics of Thin Film Devices Processed with Flip Chip Bonding Process
Kwang-Jae Shin, Jae-Hwan Kim, Jung-Yeol Choi, Tae Sung Oh, Hongik University / Korea

TE1-2
Risk of PV Fire Caused by Solder Bond Failure -Ag Dissolution into Solder in the Interconnection between Ag Electrode and Cu Ribbon-
Uichi Itoh1, Manabu Yoshida1, Hideo Tokuhisa1, Kohichi Takeuchi2, Yasuyuki Takemura2, 1AIST, 2International Test & Engineering Services / Japan

TE1-3
Comparative Analysis of the Process Window of Aluminum and Copper Wire Bonding for Power Electronics Applications
Christopher Kaestle, Joerg Franke, Friedrich-Alexander-University of Erlangen-Nuremberg / Germany

TE1-4
Direct Bonding of SiC by the Surface Activated Bonding Method
Tadatomo Suga1, Fengwen Mu1, Masahisa Fujino1, Yoshikazu Takahashi2, Haruo Nakazawa2, Kennichi Iguchi2, 1The University of Tokyo, 2Fuji Electric / Japan
10:40
10:50

Break
10:50


11:50

Keynote (Main Hall)

Implementation of High-Volume Genomic Analyses by Microfluidics/microchip Technologies:
Towards Integrative Medical Sciences for Preventive Medicine
Osamu Ohara, Kazusa DNA Research Institute; RIKEN Center for Integrative Medical Sciences
11:50
12:50

Lunch
12:50







































14:30
 TA2: Taiwan Session

TA2-1 <Session Invited>
Advanced 3D Technology Update in Taiwan
Shen-Li Fu, I-Shou University / Taiwan

TA2-2 <Session Invited> (tentative)
Heterogeous 3D Systems Integration
CP Hung, ASE / Taiwan

TA2-3
Electromigration and Thermomigration of Pb-free Microbumps in Three- Dimensional Integrated Circuits Packaging
Fan-Yi Ouyang, Wei-Cheng Jhu, Hao Hsu, Tsung-Han Yang, National Tsing Hua University / Taiwan

TA2-4
Characteristics of 600 V / 450 A IGBT Module Assembled by Ag Sintering Technology
Jing-Yao Chang, Su-Yu Fun, Fang-
Jun Leu, Kuo-Shu Kao, Chih-Ming Tzeng, Wei-Kuo Han, Chang Tao-
Chih, ITRI / Taiwan		 TB2: Materials and Processes-3

TB2-1
Tin Pest in Lead-Free Solders? -Fundamental Studies on the Effect of Impurities on Phase Transformation Kinetics-
Guang Zeng1, Stuart D. McDonald1, Keith Sweatman2, Kazuhiro Nogita1, 1The University of Queensland / Australia, 2Nihon Superior / Japan

TB2-2
Phase Transformations of Alloyed and Core-shell Metallic Nanoparticles for Interconnect Applications
 Jenn-Ming Song, National Chung Hsing University / Taiwan

TB2-3
Effect of Isothermal aging on the Growth Behavior of Cu/Al Intermetallic Compounds
 Omid Mokhtari1, Min-Su Kim1, Hiroshi Nishikawa1, Fumiyoshi Kawashiro2, Satoshi Itou2, Takehiko Maeda2, Tetsuya Hirose2, Takaki Eto2, 1Osaka University, 2Renesas Electronics / Japan

TB2-4
Effect of Nickel Addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
A.M. Zetty Akhtar, K. Hardinna Wirda, I. Siti Rabiatull Aisha, I. Mahadzir, University Malaysia Pahang / Malaysia
 TC2:Advanced Packaging-2

TC2-1
Processing and Characterization of Circuit Metallization on a Stretchable Polymer Substrate for Stretchable Electronic Packaging
Jung-Yeol Choi,Dae-Woong Park, Woo-Joon Kim, Tae Sung Oh, Hongik University / Korea

TC2-2
Flip Chip Process on a Stretchable Polymer Substrate for Stretchable Electronic Packaging
Jung-Yeol Choi, Woo-Joon Kim, Dae-Woong Park, Tae Sung Oh, Hongik University / Korea

TC2-3
Room Temperature Bonding Method for Polymer Films by Surface Activated Bonding Method using Al Intermediate Layer
 Takashi Matsumae, Masahisa Fujino, Tadatomo Suga, The University of Tokyo / Japan

TC2-4
Cutting Thin Glass by a Fiber Picosecond IR Laser
Hsiang-Chen Hsu1, Pei-Chieh Chin1, Shih-Jeh Wu1, Winphyr Lin2, 1I-Shou University, 2ENR Tech. / Taiwan

TD2: Printed Electronics-2

TD2-1 <Session Invited>
Ambient Conductive Metal Nanoink
Masayuki Kanehara1,2, 1Okayama  University, 2Colloidal Ink / japan

TD2-2 <Session Invited>
Fine Electrode Pattern Formation by Screen-offset Printing Technique
Ken-ichi Nomura1, Hirobumi Ushijima1, Kazuro Nagase2, Hiroaki Ikedo2, Ryosuke Mitsui3, Seiya Takahashi3, Shin-ichiro Nakajima3, Shiro Iwata4, 1AIST, 2Mino Group, 3Japan Aviation Electronics Industry, 4Shimane Institute for Industrial Technology / Japan

TD2-3 <Session Invited>
Reverse Offset Printing and Specialized Inks for Organic TFTs
Masayoshi Koutake, Yoshinori Katayama, DIC / Japan

TD2-4 <Session Invited>
Low Temperature Photonic Sintering for Printed Electronics
Saad Ahmed, Xenon / USA

TE2: Medical Devices

TE2-1
Effects of Ar Fast Atom Beam and Ar Plasma Irradiations on the Biocompatibility of Polymeric Materials
Mari Nakamoto, Masahisa Fujino, Tadatomo Suga, The University of Tokyo / Japan

TE2-2
Human Body Communication in Vehicle - Transmission Characteristics between the Forearm and Steering Wheel
Fukuro Koshiji1,2, Takashi Matsumoto1, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan

TE2-3 <Session Invited>
Microsystems for Minimally Invasive Medicine and Healthcare
 Yoichi Haga, Tadao Matsunaga,  Tohoku University / Japan

TE2-4 <Session Invited>
CMOS Image Sensor Technologies for Biomedical Applications
Jun Ohta, Nara Institute of Science and Technology / Japan
14:30
15:00

Break / Poster Session
15:00










































16:40
 TA3: Korea Session

TA3-1
Manufacture of Copper Substarte for LED Package and its Characteristics
Byung-Wook Ahn, Don-Hyun Choi, Seung-Boo Jung, Sungkyunkwan University / Korea

TA3-2
Optimization of Levelers Concentration to Minimize the Contamination in Copper Via Filling
Ja-Kyung Koo1, Tai-Hong Yim2, Jae-Ho Lee1, 1Hongik University, 2KITECH / Korea

TA3-3
Properties of Polymer Solar Cells with Au Nanoparticle Doped Hole Transport Layer
Byung Min Park, Gi Peum Kim, Seung Ho Kim, Ho Jung Chang, Dankook University / Korea

TA3-4
Measurement and Comparison with Simulation for the Warpage Characteristics of Package-on- Packages Processed with Thin Dies and Thin Substrates
Dong-Hyun Park1, Dong-Myung Jung1, Jung-Yeol Choi1, L. Fabiano2, C. Moraes2, E. Rhod2, W. Hasenkamp2, Tae Sung Oh1, 1Hongik University / Korea, 2Unisinos University / Brazil 		TB3: Materials and Processes-4

TB3-1 
New Interconnection Alloy Metal for High Bonding Strength -Nano Composite Particles synthesized by nanomized method-
Shigenobu Sekine1, Ryuji Kimura1, Keiji Okada1, Hiroaki Shindo1, Tatsuya Ooi1,Uichi Itoh2, Manabu Yoshida2, Hideo Tokuhisa2 1Napra, 2AIST /Japan

TB3-2
Constitutive behavior and Anand Model of Novel Lead- Free Solder Sn-Zn-Bi-In-P
Jian-Chun Liu, Hong-Jiao Yu, Gong Zhang, Zheng-Hong Wang, Ju-Sheng Ma, Tsinghua University / China

TB3-3 
Effect of Gold and Copper on Microstructural Evolution and Mechanical Durability of SAC305 Solder Joints
S. Mukherjee1, A. Dasgupta1, J. Silk2, L. L. Ong3, 1University of Maryland, 2Agilent / USA, 3Agilent / Malaysia

TB3-4 
Multilayered Sn/Ag3Sn Electroplating on Cu Alloys for High Reliable Electronic/Electric Materials
Song-Zhu Kure-Chu, Tohru Ogasawara, Hitoshi Yashiro, Rongbin Ye, Takuya Hhosokai, Michimasa Uchidate, Eiichi Suzuki, Tomoyuki Naito, Iwate University / Japan		 TC3: Advanced Packaging-3

TC3-1
A 1020-lead, 240 micron pitch, 14 x 14mm Package-on-Package (PoP) and Manufacturing Infrastructure
Rajesh Katkar, Rey Co, Wael Zohni, Invensas / USA

TC3-2
Reliability Characterization of 2.5D Multi-Chip Module on Board Under Drop Impact
Tzu-Hsuan Cheng1, Hsien-Chie Cheng2, Wen-Hwa Chen1, Hsin-Yi Huang3 Tao-Chih Chang3, 1National Tsing Hua University, 2Feng Chia University , 3ITRI / Taiwan

TC3-3
A Frequency Enhanced Single Package Multi-Die Memory System Using An In-Package Flyby Configuration
Zhuowen Sun, Kevin Chen, Kyongmo Bang, Invensas / USA

TC3-4
A Microfluidic Interposer Based on Three Dimensional Molded Substrate Technology
T. Leneke, S. Majcherek, S. Hirsch, M.-P. Schmidt, B. Schmidt, Otto-von- Guericke-University / Germany 		TD3: Printed Electronics-3

TD3-1  <Session Invited>
Ag Nanowire Film Produced by Photonic Curing
Hideki Ohata, Yasunao Miyamura, Eri Nakazawa, Hiroshi Uchida, Showa Denko / Japan

TD3-2 <Session Invited>
Study on an Interconnect Technology toward Flexible Printed Electronics
Ryosuke Mitsui1, Seiya Takahashi1, Shin-ichiro Nakajima1, Ken-ichi Nomura2, Hirobumi Ushijima2, 1Japan Aviation Electronics Industry, 2AIST / Japan

TD3-3 <Session Invited>
Printed E-textiles as Human- Machine Interfaces for Biological Signal Monitoring
Masahiro Inoue1, Yasunori Tada1, Yosuke Itabashi1, Kakeru Kaga1, Tomohiro Tokumaru2, 1Gunma University，2Biosginal / Japan

TD3-4
Relationship Between Shrinkage and Conductivity Properties of Cured Isotropic Conductive Adhesives
Shigeru Kohinata1, Yosihiko Shiraki1, Masahiro Inoue2, Keisuke Uenishi1, 1Osaka University, 2Gunma University / Japan

TE3: N-MEMS-1

TE3-1
Plastic Molded Package Technology for MEMS Sensor -Evolution of MEMS Sensor Package-
Atsushi Oouchi, STMicroelectronics / Japan

TE3-2
Miniaturized Polarization Sensors Integrated with Wire- Grid Polarizers
So Ikeda1, Eiji Higurashi1, Tadatomo Suga1, Toshiaki Oguchi2, 1The University of Tokyo, 2NSK / Japan

TE3-3
Room-Temperature Bonding using Au Compliant Rim with Ultrasonic Assist and its Application to Hermetic Sealing
Ryo Takigawa, Keiichiro Iwanabe, Takanori Shuto, Takayuki Takao, Asano Tanemasa, Kyushu University / Japan

TE3-4
Room Temperature Wafer Scale Bonding of Electroplated Au Patterns Processed by Surface Planarization
Yuichi Kurashima, Atsuhiko Maeda, Hideki Takagi, AIST / Japan
16:40
16:50

Break
16:50









































18:30
 TA4: 3DIC Packaging-2

TA4-1
Thermal Stresses around Void in Through Silicon Via in 3D SiP
Takahiro Kinoshita1, Tomoya Sugiura1, Takashi Kawakami1, Keiji Matsumoto2, Sayuri Kohara2, Yasumitsu Orii2, 1Toyama Prefectural University, 2IBM Japan / Japan

TA4-2
Thermal Stresses of TSV and Si Chip in 3D SiP under Device Operation and Reflow Process
Tomoya Sugiura1, Takahiro Kinoshita1, Takashi Kawakami1, Keiji Matsumoto2, Sayuri Kohara2, Yasumitsu Orii2, 1Toyama Prefectural University, 2IBM Japan / Japan

TA4-3
Virtical and Horizontal Location Design of Program Voltage Generator for 3D-Integrated ReRAM/NAND Flash Hyhrid SSD
Tomoya Ishii, Koh Johguchi, Ken Takeuchi, Chuo University / Japan

TA4-4
Accurate Resistance Measuring Method for High Density Post- Bond TSVs in 3D-SIC with Electrical Probes
Shuichi Kameyama1,2, Masayuki Baba1, Yoshinobu Higami2, Hiroshi Takahashi2, 1Fujitsu, 2Ehime University / Japan
 TB4: Materials and Processes-5

TB4-1
Evaluation of Embedded Capacitors with Graft-Modified BaTiO3/Epoxy as Dielectrics
Maobai Lai, Shuhui Yu, Rong Sun, Chinese Academy of Sciences / China

TB4-2
Effect of Chemical Factors on the Evolution of Electrical Conductivity during Curing In Ag- Loaded Conductive Adhesives Composed of an Epoxy-Based Binder -A New Understanding of Electrically Conductive Adhesives-
Yoshiaki Sakaniwa, Yasunori Tada, Masahiro Inoue, Gunma University / Japan

TB4-3
Ultrasonic Bonding Method for Thin Film Capacitor Module
Atsunori Hattori, Hirotaka Hatano, Hirotaka Ogawa, NODA SCREEN / Japan
(18:05)
 TC4: DMR-Electrical-1

TC4-1
A Built-in Supply Current Test Circuit for Pin Opens in Assembled PCBs
Shoichi Umezu, Masaki Hashizume, Hiroyuki Yotsuyanagi, University of Tokushima / Japan

TC4-2
Pin Open Detection of BGA IC by Supply Current Testing
Akira Ono1, Hiroyuki Yotsuyanagi2, Masaki Hashizume2, 1Kagawa National College of Technology, 2University of Tokushima / Japan

TC4-3
Electrical Test Method of Open Defects at Data Buses in 3D SRAM IC
Yudai Shiraishi1, Masaki Hashizume1, Hiroyuki Yotsuyanagi1, Tada Tetsuo2, Shyue-Kung Lu3, 1 University of Tokushima, 2Tokushima Bunri University / Japan, 3National Taiwan University of Science and Technology / Taiwan

TC4-4
Method for Back-Annotating Per-Transistor Power Values onto 3DIC Layouts to Enable Detailed Thermal Analysis
Samson Melamed1, Fumito Imura1, Masahiro Aoyagi1, Hiroshi Nakagawa1, Katsuya Kikuchi1, Michiya Hagimoto2, Yukoh Matsumoto2, 1AIST, 2TOPS Systems / Japan
 TD4: Printed Electronics-4

TD4-1
Inkjet Printed Wireless Biosensors on Stretchable Substrate
Hannu Sillanpaa, Eerik Halonen, Toni Liimatta, Matti Mantysalo, Tampere University of Technology / Finland

TD4-2
Multilayer Ceramic Coil for Wireless Power Transfer System by Photo Resist Film Process
Minami Takato, Tatsuya Nishi, Masato Kaneko, Junichi Tanida, Syogo Tada, Ken Saito, Fumio Uchikoba, Nihon University / Japan
(17:40)

TE4: N-MEMS-2

TE4-1
Electromagnetic Induction Type Micro Generator Combined with MEMS Air Turbine and Multilayer Ceramic Magnetic Circuit
Y. Yokozeki, M. Kaneko, T. Nishi, H. Endo, K. Hoshi, N. Yoshida, K. Hosoya, R. Saito, M. Takato, K. Saito, F. Uchikoba, Nihon University / Japan

TE4-2
Impact-Type MEMS Microrobot Controlled by Bare Chip IC of Hardware Neuron
M. Tatani, K. Maezumi, M. Takato, S. Yamasaki, H. Obara, Y. Naito, K. Iwata, Y. Okane, Y. Ishihara, T. Hidaka, Y. Asano, H. Oku, K. Sito, F. Uchikoba, Nihon University / Japan

TE4-3
A Bio-Inspired Cylindrical Tactile Sensor for Multidirection Pressure Detection
Nurul Adni Ahmad Ridzuan1, Norihisa Miki1,2, 1Keio University, 2JST PRESTO / Japan

TE4-4
Characterization of Tactile Display of Stiffness Distribution Using Magneto-rheological Fluid
Hiroki Ishizuka1, Nicolo Lorenzoni2, Norihisa Miki1, 1Keio University / Japan, 2Politecnico di Milano / Italy, 3JST PREST / Japan

*DMR: Design, Modeling and Reliability


April 25

Room A (Main Hall)

Room B (201)

Room C (202)

Room D (203)

Room E (204)
9:00














































10:40
 FA1: Thermal Management-2

FA1-1 <Session Invited>
Thermal Management of Dense Electronic Packaging by Heat Pipe and Piezo Fan Based Cooling Solutions
Randeep Singh, Fujikura / Japan

FA1-2
Cooling Technology of On- Vehicle Inverters with Functional Nano-Porous Foam Layer -Enhancement of Wettability and boiling heat transfer toward inverter cooling-
Kazuhisa Yuki1, Tessai Sugiura2, Koichi Suzuki1, 1Tokyo University of Science-Yamaguchi, 2Tohoku University / Japan

FA1-3
Integrated Vapor Chamber Heat Spreader for High Power Processors
Thanh-Long Phan, Yuji Saito, Masataka Mochizuki, Fujikura  / Japan

FA1-4
Effect of Thermal Properties of Interposer Material on Thermal Performance of 2.5D Package
Takashi Hisada, Yasuharu Yamada, IBM Japan / Japan		 FB1: DMR-Electrical-2

FB1-1
Locally Shielded Differential-
Paired Lines with Bend Discontinuities for SI and EMI Performances
Yoshiki Kayano1, Masashi Ohkoshi1, Takuya Watabe1, Hiroshi Inoue2, 1Akita University, 2The Open University of Japan / Japan

FB1-2
Electrical Characteristics of Build-up Substrates Using New Via Structures
Tomoyuki Akahoshi1, Daisuke Mizutani1, Motoaki Tani1, Kenichirou Abe2, Syunji Baba3, Masateru Koide3, 1Fujitsu Laboratories, 2Fujitsu Interconnect Technologies, 3Fujitsu Advanced Technologies / Japan

FB1-3
A Multiband Antenna with Fan- Shaped Monopole and Folded Element of 800 MHz, 2.0 GHz and UWB for 4G Smartphones
Yusuke Akiyama1, Fukuro Koshiji1,2, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan

Cancelled
Enhanced Passive Equalizer Using the Open Stub Compensation Technique
Sheng-Hua Huang1, Chih-Wen Kuo1, Chen-Chao Wang2, Toshihide Kitazawa3, 1National Sun Yat- Sen University, 2ASE / Taiwan, 3Ritsumeikan University / Japan
 FC1: Advanced Packaging-4

FC1-1
Characterization of Micro Bump Formed by Injection Molded Solder (IMS) Technology
Toyohiro Aoki, Kazushige Toriyama, Hiroyuki Mori, Yasumitsu Orii, IBM Japan / Japan

FC1-2
Packaging of High-Temperature Planar Power Modules Interconnected by Low-
temperature Sintering of Nanosilver Paste
David W. Berry1, L. Jiang1, Yunhui Mei2, Shufang Luo3, Khai D. Ngo1, Guo-Quan Lu1,2, 1Virginia Tech / USA, 2Tianjin University / China, 3NBE Technologies / USA

FC1-3
High-Speed Gold Laser-Plating on Nickel-Plated Copper Leadframe toward Flip-Chip Packaging
Takahisa Sagawa1, Mamoru Mita2, Kazuhiko Yamasaki1, Katsuhiro Maekawa1,2, 1Ibaraki University,  2M&M Research Laboratory / Japan

FC1-4
Package on Package DDR Power Integrity Design
Heng Chuan Shu, Li Chuang Quek, Intel Microelectronics (M) / Malaysia 		FD1: Interconnection-1

FD1-1
Fine-pitch Solder Joining for High Density Interconnection
Kuniaki Sueoka, Sayuri Kohara, Akihiro Horibe, Fumiaki Yamada, Hiroyuki Mori, Yasumitsu Orii, IBM Research-Tokyo / Japan

FD1-2
Fine-Pitch Hybrid Bonding with Cu/Sn Microbumps and Adhesive for High Density 3D Integration
Masaki Ohyama1, Jun Mizuno1, Shuichi Shoji1, Masatsugu Nimura1,2, Toshihisa Nonaka3, Yoichi Shinba3, Akitsu Shigetou4, 1Waseda University, 2Toray Engineering, 3Toray Industries, 4NIMS / Japan

FD1-3
The Fine Pitch Cu-pillar Bump Interconnect Technology Utilizing NCP Resin, Achieving the High Quality and Reliability
Yoshikazu Shimote, Toshihiro Iwasaki, Masaki Watanabe, Shinji Baba, Michitaka Kimura, Renesas Electronics / Japan

FD1-4
Effects of Bump Height and UBM Structure on The Reliability Performance of 60μm-Pitch Solder Micro Bump　Interconnectionｓ
Yu-Wei Huang1, Chau-Jie Zhan1, Lin Yu-Min1, Jing-Ye Juang1, Shin-Yi Huang1 Su-Mei Chen1, Chia-Wen Fan1, Ren-Shin Cheng1, Shu-Han Chao2, C. K. Lin2, Jie-An Lin2, Chih Chen2, 1ITRI, 2National Chiao Tung University / Taiwan 		FE1: Optoelectronics-1

FE1-1 <Session Invited>
Flip Chip LED Packaging Study & Technology Trend
Tetsuya Onishi, Grand Joint Technology / Hong Kong

FE1-2
Lens Forming by Stack Dispensing for LED Wafer Level Packaging
Rong Zhang, Shi-Wei Ricky Lee, Jeffery Lo, HKUST / Hong Kong

FE1-3
Dispensed Dome Lens Validation Through Optical Simulations for High Illuminance UV LED Module
Cheng-Chun Liao, Hao-Xiang Lin, Chien-Lin Chang Chien, Chung-Min Chang, Chih-Peng Hsu, Advanced Optoelectronic Technology / Taiwan

FE1-4
Effect of Die-attach Material on Thermal Performance of Chip-on- Board Packaging of 10W High Power LED Arrays
Xin Li, Tianjin University / China
10:40
10:50

Break
10:50

11:50

Keynote (Main Hall)

Gen-3 Embedded Cooling: Completing the Inward Migration of Thermal Packaging
Avram Bar-Cohen, DARPA-MTO
11:50
12:50

Lunch
12:50


























































14:55
 FA2: More-than-Moore 2.0
　- Is 2D really saturating? Will 3D really be coming?-

FA2-1 <Session Invited> (50min.)
Progress and Benchmarking of CMOS-Device Technologies
Hitoshi Wakabayashi, Tokyo Institute of Technology / Japan

FA2-2 <Session Invited> 
BEOL Device Technologies for Energy Efficient Computing
Munehiro Tada, LEAP / Japan

FA2-3 <Session Invited> 
TBD
Koji Nii, Renesas Electronics / Japan

FA2-4 <Session Invited> 
The New Cognitive Computing Era by 3D Integration
Yasumitsu Orii, IBM Japan / Japan

FA2-5
A Novel 3D IC Assembly Process for Ultra-Thin Chip Stacking
Yu-Min Lin1, Chau-Jie Zhan1, Zhi-Cheng Hsiao1, Huan-Chun Fu1, Ren-Shin Cheng1, Yu-Wei Huang1, Shin-Yi Huang1, Su-Mei Chen1, Chia-Wen Fan1, Chun-Hsien Chien1, Cheng-Ta Ko1, Yu-Huan Guo2, Chang-Chun Lee2, Yoshihiro Tsutsumi3, Junsoo Woo3, Yoshikazu Suzuki3, Yusuke Sato3, Chien-Ting Liu3, Chih-Heng Chao3, 1ITRI, 2Chung Yuan Christian University / Taiwan, 3DISCO / Japan

FA2-6
Cu-Cu Wafer Bonding: An Enabling Technology for Three- Dimensional Integration
B. Rebhan1, T. Plach1, S. Tollabimazraehno2,3, V. Dragoi1, M. Kawano1, 1EV Group, 2Johannes Kepler University, 3Christian Doppler Laboratory for Microscopic and Spectroscopic Material Characterization / Aurtria

FA2-7
High-performance Cooling System with Multi-channel Electro-osmotic Flow Pumps for High-power 3D-ICs
 H. Kudo1, T. Yonekawa1, S. Yoshimi1, Y. Oguri2, A. Tsukune3, Y. S. Kim3, H. Kitada3, K. Fjimoto1, I. Kinefuchi2, Y. Matsumoto2, T. Ohba3, 1Dai Nippon Printing, 2University of Tokyo, 3Tokyo Institute of Technology / Japan


Panel Discussion (tentative)

The panel will discuss new collaboration opportunities across the supply chain that may overcome possible economic constraints on the pace of device scaling.





*This session will break for 30min. so that participants may join the Poster Session.
 FB2: DMR-Mechanical

FB2-1;
Investigation of Solder Creep Behavior on Wafer Level CSP Under Thermal Cycling Loading
Kai-Chiang Wu, Kuo-Ning Chiang, National Tsing Hua University / Taiwan

FB2-2
Solder Crack Simulation using SPH Particle Method with Sub- Modeling Technique
Chihiro J. Uchibori1, Seiki Sakuyma1, Yuzuru Sakai2, Thyon Su-I2, Takayuki Watanabe2, Nobuki Yamagata3, 1Fujitsu Laboratories, 2Yokohama National University, 3Advanced Creative Technology / Japan

FB2-3
Stress Variation Analysis during Curing Process of Epoxy Underfill
Hiroshi Yamaguchi, Toshiaki Enomoto, Toshiyuki Sato, Namics / Japan

FB2-4
Reliability Improvements in Electronic Systems by Combining Condition Monitoring Approaches
Kathleen Jerchel2, Michael Krueger1, Andreas Middendorf1, Nils F. Nissen2, Klaus-Dieter Lang1, 1Technische Universität Berlin, 2Fraunhofer IZM Berlin / Germany

FB2-5
Fatigue Strength of Through Hole in Printed Circuit Board
Shogo Iwade1, Takahiro Kinoshita1, Takashi Kawakami1, Hideki Mizushina2, Hiroshi Iinaga2, 1Toyama Prefectural University，2Oki Printed Circuits / Japan		 FC2: Thermal Management-3

FC2-1
Development of 1kW DMFC System with Waste Heat Recovery for Improving Energy Efficiency
Yuki Morimatsu, Zhen Guo, Masakazu Ohashi, Fujikura / Japan

FC2-2
Calculation of Temperature Distribution of Power Si MOSFET with Electro-Thermal Analysis -The Effect of Boundary Condition-
Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka, Toyama Prefectural University / Japan

FC2-3
Molecular Modelling Approach to Screen Novel Thermal Management Materials
Chatterjee Abhijit, Accelrys / Japan

FC2-4
Thermal Management of Embedded Device Package
Yukari Imaizumi, Toru Suda, Shigenori Sawachi, Akio Katsumata, Yoichi Hiruta, J-Devices / Japan

FC2-5
Thermal Modeling of Electronic Components for Thermal Simulation of Electronic Equipment
Katsuhiro Koizumi1, Tomoyuki Hatakeyama2, Takashi Fukue3, Masaru Ishizuka2, 1Cosel，2Toyama Prefectual University, 3Iwate University / Japan

FD2: Interconnection-2

FD2-1
Nanoscale Bondability between Cu-Al Intermetallic Compound for Cu Wirebonding
Hsiang-Chen Hsu1, Jih-Hsin Chien1, Jian-Siang Huang1, Li-Ming Chu2, Shen-Li Fu1, 1I-Shou University, 2Southern Taiwan University of Science and Technology / Taiwan

FD2-2
Effect of Pd Thickness on Bonding Reliability of Pb Coated Copper Wire
Jun Cao1,2, JunLing Fan3, ZhiQiang Liu1, YueMin Zhang1, 1HeNan Ploytechnic Universtiy, 2HeNan YOUK Electronic Material, 3 Jiaozuo University / China

FD2-3
Reliability Evaluation of Bonding between Cu Wire and Al Pad
Yuji Ishida, Nobuhiko Ota, Shinji Yamashita, Yaskawa Electric / Japan

FD2-4
The Growth of Ag3Sn Intermetallic Compound under a Temperature Gradient
Yu-Ping Su, Fan-Yi Ouyang, National Tsing Hua University / Taiwan

FD2-5
Phase Evolution and Nanomechanical Properties of Intermetallic Compounds in Solid-Liquid Interdiffusion Bonding
Jenn-Ming Song1, Wei-Chih Lu2, 1National Chung Hsing University, 2National Dong Hwa University / Taiwan

FE2: Optoelectronics-2

FE2-1
High-ON/OFF-Contrast 10-Gb/s Silicon Mach-Zehnder Modulator in High-Speed Low-Loss Package
Hiroki Ishihara1, Kenji Oda1, Ori Teijiro1, Kazuhiro Goi1, Kensuke Ogawa1, Taung-Yang Liow2, Xiaoguang Tu2, Guo-Qiang Lo2, Dim- Lee Kwong2, 1Fujikura / Japan, 2A*STAR / Singapore

FE2-2
Multi-channel and High-density Hybrid Integrated Light Source by Thermal Management for Low Power Consumption for Ultra-high Bandwidth Optical Interconnection
Takanori Shimizu1,2, Makoto Okano1,3, Hiroyuki Takahashi1,2, Nobuaki Hatori1,2 Masashige Ishizaka1,2, Tsuyoshi Yamamoto1,2, Masahiko Mori1,3, Tsuyoshi Horikawa1,3, Takahiro Urino1,2, Takahiro Nakamura1,2, Yasuhiko Arakawa1,4, 1PECST, 2PETRA, 3AIST, 4The University of Tokyo / Japan

FE2-3
High-Density Wiring of Polymer Optical Waveguides Fabricated Using a Microdispenser
Daisuke Suganuma, Takaaki Ishigure, Keio University / Japan

FE2-4
Optimal Cavity Length in Cavity- Resonator-Integrated Guided- Mode Resonance Filter
Junichi Inoue1, Tomohiro Kondo1, Kenji Kintaka2, Kenzo Nishio1, Yasuhiro Awatsuji1, Shogo Ura1, 1Kyoto Institute of Technology，2AIST / Japan

FE2-5
A Varifocal Lens Using an Electrooptic KTa1-xNbxO3 Crystal with a Microsecond Order Response Time
Tadayuki Imai, Takahiro Inagaki, Jun Miyazu, Souhan Kawamura, Junya Kobayashi, NTT / Japan

14:55
15:25

Break / Poster Session
15:25
















































17:30
 FB3: Materials and Processes-6

FB3-1
Effect of Joining Conditions on the Joint Strength of Ag Nanoporous Bonding
Min-Su Kim, Hiroshi Nishikawa, Osaka University / Japan

FB3-2
Development of Low- Temperature Sintered Nano- Silver Pastes Using MO Technology and Resin Reinforcing Technology
Noritsuka Mizumura, Koji Sasaki, Namics / Japan

FB3-3
A Diffusion-Viscous Analysis of Pressure-Aided Drying of Nanosilver Bond-line for Low-
Temperature Chip Joining
Kewei Xiao1, Khai D.T.Ngo1, Guo-Quan Lu1,2, 1Virginia Tech / USA, 2Tianjin University / China

FB3-4
Measurements of Electrical Resistance and Temperature Distribution During Current Assisted Sintering of Nanosilver Die-Attach Material
Guo-Quan Lu1,2, Wanli Li1, Yunhui Mei1, Xin Li1, 1Tianjin University / China, 2Virginia Tech / USA

FB3-5 Cancelled
Challenges of Super High Thermal Performance Adhesive in Power Device Application
Wei Hing Tan, Hui Teng Wang, Samsun Paing, Infineon Technologies (Malaysia) / Malaysia

 FC3:Thermal Management-4

FC3-1
One-Dimensional Thermal Network Expression of Tablet Device with Slate Style Chassis
Koji Nishi1, Tomoyuki Hatakeyama2, Shinji Nakagawa2, Masaru Ishizuka2, 1AMD Japan, 2Toyama Prefectural University / Japan

FC3-2
Simulation Based Method to Eliminate the Effect of Electrical Transients from Thermal Transient Measurements
Andras Vass-Varnai, Zoltan Sarkany, Attila Szel, Marta Rencz, Mentor Graphics / Hungary

FC3-3
Thermal Transient Test based Thermal Structure Function Analysis of IGBT Package
Yafei Luo1,3, Yasushi Kajita2, Tomoyuki Hatakeyama3, Shinji Nakagawa3, Masaru Ishizuka3, 1Mentor Graphics Japan, 2Nagoya Municipal Industrial Research Institute, 3Toyama Prefectural University / Japan
(16:40)

FD3: Interconnection-3

FD3-1
Formic Acid Treatment with Pt Catalyst for Cu Direct Bonding at Low Temperature
Tadatomo Suga, Masakate Akaike, Naoya Matsuoka, The University of Tokyo / Japan

FD3-2
Plasma Assisted Bonding of  Copper and Silver Substrates
Masahisa Fujino, Kentaro Abe, Tadatomo Suga, The University of Tokyo / Japan

FD3-3
Room-Temperature Direct Bonding of Graphene Films by Means of Vacuum Ultraviolet (VUV) / Vapor-Assisted Method
Ajayan Mano1,2, Akitsu Shigeto1, Jun Mizuno2, Shuichi Shoji2, 1NIMS, 2Waseda University / Japan

FD3-4
Evaluation of Ultrasonic Vibration Energy for Copper-To-Copper Bonding by Flip-Chip Bonding Technology
Yoshiyuki Arai1,2, Yoshinori Miyamoto 2, Masatsugu Nimura2, Hajime Tomokage3, 1Toray Engineering, 2Fukuoka University / Japan

(17:05)

FE3: Optoelectronics-3

FE3-1
Nanomaterials for Silicon Photonic Packaging
Yoichi Taira, Kuniaki Sueoka, Hidetoshi Numata, IBM Research - Tokyo / Japan

FE3-2
Organic-Inorganic Hybrid Material for Optical Interconnects and Application to Optical Coupling Method
Hideyuki Nawata, Kentaro Ohmori,  Nissan Chemical Industries / Japan

FE3-3
Bond Properties of Silane Modified Optical Adhesives for Silicon Photonics
Seiko Mitachi1, Arisa Hagiwara1, Norio Murata1, Hirokazu Kageyama2, Kazushi Kimura2, 1Tokyo University of Technology, 2The Yokohama Rubber / Japan

FE3-4
Low-Temperature GaAs/SiC Wafer Bonding with Au Thin Film for High-Power Semiconductor Lasers
Ken Okumura1, Eiji Higurashi1, Tadatomo Suga1, Kei Hagiwara2, 1The University of Tokyo, 2NHK Science and Technology Research Laboratories / Japan

FE3-5
Surface Activated Ge/GaAs Wafer Bonding for Multi-junction Solar Cells
Genki Kono, Masahisa Fujino, Daiji Yamashita, Kentaroh Watanabe, Masakazu Sugiyama, Yoshiaki Nakano, Tadatomo Suga, The University of Tokyo / Japan
*DMR: Design, Modeling and Reliability


Poster Session 

Poster sessions will be held from 14:30-15:00 on April 24 and from 14:55-15:25 on April 25.

P01



P02


P03


P04


P05


P06



P07


P08



P09



P10


P11



P12


P13


P14


P15


P16


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P18


P19


P20



P21


P22


P23



P24




P25


P26


P27
 Analysis of Temperature Distribution in Stacked IC with a Thermal Simulation and a Specially Designed Test Structure
 Keita Yamada1, Toshihiro Matsuda1, Hideyuki Iwata1, Tomoyuki Hatakeyama1, Masaru Ishizuka1, Takashi Ohzone2, 1Toyama Prefectural University, 2Dawn Enterprise / Japan

Efficient Delay-matching Bus Routing by using Multi-layers
Yang Tian, Ran Zhang, Takahiro Watanabe, Waseda University / Japan

Proposal of the application of the delamination test to semiconductor package design
Ryuichi Kusama1, Qiang Yu2, Kyohei Yamashita2, Tomohiko Takeda2, 1DENSO, 2Yokohama National University / Japan

Behavior Analysis Method for Product Design Support
Eiji Morinaga, Hidefumi Wakamatsu, Eiji Arai, Hijiri Abiru, Osaka University / Japan

Clarification of Transmission Mechanism in Human Body Communication between Head-Mounted Wearable Devices
Dairoku Muramatsu, Yoshiaki Yokoyama, Ken Sasaki, The University of Tokyo / Japan

Cancelled
Input Impedance Characteristics of Horse-shoe Shaped Electrodes in Dry/Wet Skin Conditions for Human Body Communication
Takaaki Fujisawa1, Fukuro Koshiji1, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan

Electromagnetic field analysis of Human Body Communication between Wearable and Stationary Devices including the Earth Ground
Misaki Kurosu1, Fukuro Koshiji1, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan

Cancelled
Comparison of Body Area Transmission Characteristics Using Right-Handed and Left-Handed Coils as a Wearable Antenna
Nanako Yuyama1, Fukuro Koshiji1, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan

Hemocompatibility of DLC coating for blood analysis devices
Keisuke Shiba1, Yasuharu Ohgoe, Kenji Hirakuri, Jun Mizuno, Shuichi Shoji, Kazuhide Ozeki, Keisuke Sato, Hukata Naoki, Ali Alanazi, 1Tokyo Denki University, 2Waseda University, 3Ibaraki University, 4International Center of Materials Nanoarchitectonics, 5King Saud University / Japan

Effect of filler morphology on fatigue properties of stretchable wires printed with Ag pastes
Yosuke Itabashi, Yasunori Tada, Masahiro Inoue, Gunma University / Japan

Flexible and Capacitive Tactile Sensor Sheet
Masanori Mizushima1, Shigeo Takagi1, Hiromichi Itano1, Tsutomu Obata2, Takashi Kasahara3, Shuich Shoji3, Jun Mizuno3, 1Oga, 2Toyama Industrial Technology Center, 3Waseda University / Japan

Leadfree Solder joint non- uniformity study on SMT
Anocha Sriyarunya, Jiraporn Tondtan, SPANSION(THAILAND) / Thailand

Impact Properties of Sn-3Ag-0.5Cu Solder Ball Joint with Epoxy-Based Flux
Akiyoshi Ishiyama1, Shohji Ikuo1, Ganbe Tatsuya2, Watanabe Hirohiko2, 1Gunma University, 2Fuji Electric / Japan

Influence of intermetallic compounds on tensile strength of lead-free solder
Masaya Iwasaki, Masashi Kurose, Akira Yamauchi, Gunma National College of Technology / Japan

Increasing Bonding Strength of Chips and Substrates Assembly by Argon Plasma
Cheng-Li Chuang1, Jong-Ning Aoh2, Bo-Zhi Yang2, 1Chung Shan Medical University, 2National Chung Cheng University / Taiwan

Effect of Coupling Agent on Adhesion of Underfill Materials on Copper
Hironao Mitsugi, Ikuo Shohji, Shinji Koyama, Shinya Kitagoh, Gunma University / Japan

Effect of Fiber Direction and Temperature on Mechanical Properties of Short Fiber-Reinforced PPS
Ryogo Takahashi1, Ikuo Shohji1, Yuki Seki2, Satoshi Maruyama2, 1Gunma University, 2Yamada Manufacturing / Japan

Preparation of Aligned Conjugated Polymer Fibers By Electrospinning
Hsiao-Chung Chu, Cho-Liang Chung, Yu-Hsuan Lin, Sheng-Li Fu, I-Shou University / Taiwan

Morphology And Applications of TiO2 Electrospun Nanofiber
Wei Chen, Cho-Liang Chung, Chih-Hao Hsu, Sheng-Li Fu, I-Shou University / Taiwan

The study of optical variation for dispensing Lens type LED package
Chien-Lin Chang Chien, Yu-Wei Tsai, Ya-Ting Wu, How-Wen Chen, Zheng-Hua Yang, Chung-Min Chang, Chih-Peng Hsu, Advanced Optoelectronic Technology / Taiwan

Thermal Effect on the Radiation Flux of UV COB LED Package
Yu-Wei Tsai, Chien Lin Chang Chien, Cheng Chun Liao, Chung-Min Chang, Chih-Peng Hsu, Fuh-Shyang Juang, Advanced Optoelectronic Technology / Taiwan

Robust lensed fibers having high focusing effects in resin bond
Kazuo Shiraishi1, Masaru Horiuchi1, Hidehiko Yoda1, Chen S. Tsai2, 1Utsunomiya University / Japan, 2University of California / USA

A spot-size converter with vertical down taper for the coupling between single-mode fiber and silicon-wire waveguide
Kazuo Shiraishi1, Ryutaro Takasaki1, Hidehiko Yoda1, Hideya Oshikiri1, Chen S. Tsai2, 1Utsunomiya University / Japan, 2University of California / USA


Cancelled
A Novel S-Bridged Power Plane With Ultra Wideband Suppression of Ground Bounce Noise Using Open Stub on High Speed Circuit
Meng-Huan Lu1, Chen-Chao Wang2, Chih-Wen Kuo1, Toshihide Kitazawa3, 1National Sun Yat- Sen University, 2Advanced Semiconductor Engineering / Taiwan, 3Ritsumeikan University / Japan

Study on Bent Type of UWB Antenna Built in Electronic Equipment Housing
Daisuke Momose, Takahiko Yamamoto, Kouji Koshiji, Tokyo University of Science / Japan

A Flexible Broadband Antenna with Fan-Shaped and Trapezoidal Elements formed on Printed Circuit Board for Ultra-Wideband Radio
Kazuya Hiraguri1, Fukuro Koshiji1, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan

Comparison of Wireless Power Transmission Characteristics Using Circular-Coil Array and Elliptical Coil as a Transmission Coil
Kohei Horigome1, Fukuro Koshiji1, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan

REMINDER: ICEP2014 is scheduled on the week between the Easter weekend and Japan's spring holiday week called the Golden Week. It is strongly advised that participants reserve their flights and accommodation as early as possible.

 

 

 

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